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Summary
Integrated operation and management using IT (T/S and UMPC)

Technique to reduce the upper area of architecture with reducing the height of outer box
  • Distribution panel for very high voltage
  • Main distribution panel for low voltage
  • Low-Voltage Branch Panel (MCCB)
    		•
    Expected Effect

    Technique for simplification of purchase process with standardization

     
     
    Technique to reduce the upper area of architecture with reducing the height of outer box
       Distribution panel for very high voltage
     
         Device arrangement technique by systematic flow method
    - Three-side type consisted of LBS (LA) plate, MOF (PT) plate, and VCB (CT, LA) plate is changed to
      one-side type
    - The height of the outer box is reduced to 2100mm and the side depth to 3300mm.
    ΆΡ Patent registration : 0615721 (17 Aug 2006)