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Summary
Integrated operation and management using IT (T/S and UMPC)

Technique to reduce the upper area of architecture with reducing the height of outer box

  • Distribution panel for very high voltage
  • Main distribution panel for low voltage
  • Low-Voltage Branch Panel (MCCB)
  • Expected Effect

    Technique for simplification of purchase process with standardization

     
     
    Technique to reduce the upper area of architecture with reducing the height of outer box
       Main distribution panel for low voltage
     
         Technique for horizontal device arrangement avoiding the upper wiring in outer box
            <upper wiring is the cause to heighten the outer box>
    - Low-voltage main transfer panel (ATS) and Tie panel are integrated at one side and ACB is installed
      at the lateral side.
    - Height of distribution panel is reduced by abut 500mm and the upper installation area is reduced to
      about one half.
    ΆΡ Patent registration : 0665044 (28 Dec 2006)