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Summary
Integrated operation and management using IT (T/S and UMPC)

Technique to reduce the upper area of architecture with reducing the height of outer box
Expected Effect
  • Saving effect by 20-30% in the outer box, material, manufacture, and labor costs
  • Saving effect by 50-60% in the copper bus bars of wiring (based on 1,500KVA)
  • Reduced upper area of architecture to one half
  • Effect when incoming/distribution panels are installed on the above-ground floors and interim floors
         of the building
  • Reduced back wiring work with use of PCB sequence circuit
  • Preparation of maintenance space between very high voltage panel and low voltage panel
    		•

    Technique for simplification of purchase process with standardization

     
     
    Expected Effect
       Saving effect by 20-30% in the outer box, material, manufacture, and labor costs
        (based on 1,500KVA)
     
    Classification
    Traditional
    Improvement
    Remarks
    Outer box manufacture
    Material (incl labor cost)
    Total
    29,600
    45,100
    74,700
    21,400
    26,800
    48,200
    ACB and copper
    bus bars etc.