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Summary
Integrated operation and management using IT (T/S and UMPC)

Technique to reduce the upper area of architecture with reducing the height of outer box

Expected Effect
  • Saving effect by 20-30% in the outer box, material, manufacture, and labor costs
  • Saving effect by 50-60% in the copper bus bars of wiring (based on 1,500KVA)
  • Reduced upper area of architecture to one half
  • Effect when incoming/distribution panels are installed on the above-ground floors and interim floors
         of the building
  • Reduced back wiring work with use of PCB sequence circuit
  • Preparation of maintenance space between very high voltage panel and low voltage panel
  • Technique for simplification of purchase process with standardization

     
     
    Expected Effect
       Reduced back wiring work with use of PCB sequence circuit
     
         Easy assembling at the field in connection with standardization in future
     
         Saving manufacturing labor cost by 10-15%